when creating multiple bonding devices one of the physical device always reports link down

Solution Verified - Updated -

Issue

  • when creating multiple bonding devices one of the physical device always reports link down

    [tumeya@olive wrx0530march-183646]$ more proc/net/bonding/bond0
    Ethernet Channel Bonding Driver: v3.2.4 (January 28, 2008)
    
    Bonding Mode: fault-tolerance (active-backup)
    Primary Slave: None
    Currently Active Slave: eth0
    MII Status: up
    MII Polling Interval (ms): 0
    Up Delay (ms): 0
    Down Delay (ms): 0
    ARP Polling Interval (ms): 100
    ARP IP target/s (n.n.n.n form): 16.148.240.1
    
    Slave Interface: eth0
    MII Status: up
    Link Failure Count: 2
    Permanent HW addr: 00:25:b3:a5:59:a2
    
    Slave Interface: eth1
    MII Status: up
    Link Failure Count: 1
    Permanent HW addr: 00:25:b3:a5:59:a4
    [tumeya@olive wrx0530march-183646]$ more proc/net/bonding/bond1
    Ethernet Channel Bonding Driver: v3.2.4 (January 28, 2008)
    
    Bonding Mode: fault-tolerance (active-backup)
    Primary Slave: None
    Currently Active Slave: eth4
    MII Status: up
    MII Polling Interval (ms): 0
    Up Delay (ms): 0
    Down Delay (ms): 0
    ARP Polling Interval (ms): 100
    ARP IP target/s (n.n.n.n form): 10.0.0.1, 10.0.0.2
    
    Slave Interface: eth4
    MII Status: up
    Link Failure Count: 3
    Permanent HW addr: 00:22:64:0f:d3:78
    
    Slave Interface: eth5
    MII Status: down
    Link Failure Count: 12
    Permanent HW addr: 00:22:64:0f:d3:7c
    

Environment

  • Red Hat Enterprise Linux 5.4
  • Two bonds are configured. One with bnx2, the other with bnx2x.

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