when creating multiple bonding devices one of the physical device always reports link down
Issue
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when creating multiple bonding devices one of the physical device always reports link down
[tumeya@olive wrx0530march-183646]$ more proc/net/bonding/bond0 Ethernet Channel Bonding Driver: v3.2.4 (January 28, 2008) Bonding Mode: fault-tolerance (active-backup) Primary Slave: None Currently Active Slave: eth0 MII Status: up MII Polling Interval (ms): 0 Up Delay (ms): 0 Down Delay (ms): 0 ARP Polling Interval (ms): 100 ARP IP target/s (n.n.n.n form): 16.148.240.1 Slave Interface: eth0 MII Status: up Link Failure Count: 2 Permanent HW addr: 00:25:b3:a5:59:a2 Slave Interface: eth1 MII Status: up Link Failure Count: 1 Permanent HW addr: 00:25:b3:a5:59:a4 [tumeya@olive wrx0530march-183646]$ more proc/net/bonding/bond1 Ethernet Channel Bonding Driver: v3.2.4 (January 28, 2008) Bonding Mode: fault-tolerance (active-backup) Primary Slave: None Currently Active Slave: eth4 MII Status: up MII Polling Interval (ms): 0 Up Delay (ms): 0 Down Delay (ms): 0 ARP Polling Interval (ms): 100 ARP IP target/s (n.n.n.n form): 10.0.0.1, 10.0.0.2 Slave Interface: eth4 MII Status: up Link Failure Count: 3 Permanent HW addr: 00:22:64:0f:d3:78 Slave Interface: eth5 MII Status: down Link Failure Count: 12 Permanent HW addr: 00:22:64:0f:d3:7c
Environment
- Red Hat Enterprise Linux 5.4
- Two bonds are configured. One with bnx2, the other with bnx2x.
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