CLEVER Physics-Based Parasitic Extractor uses 3D field solvers to directly convert the mask data of a cell and relevant process information into a SPICE netlist, back annotated with the most accurate interconnect capacitance and resistance parasitics. This direct, one step process completely removes inaccuracies resulting from traditional, rule-based parasitic extractors. Key Features Direct linking of semiconductor process information to IC layout parasitic extraction without the loss of accuracy resulting from curve-fitting parasitic data to empirical formulas Only RC extractor in the industry capable of evaluating the lithographic effects of OPC and its impact on interconnect parasitics Optolithographic 3D solver models sub-wavelength effects-optical proximity correction (OPC), phase shift mask (PSM), misalignment, defocus, and Δ CD Inherent accuracy means that CLEVER can validate any interconnect model library True 3D field solver engine offers the highest interconnect RC extraction accuracy and fast feedback to process modifications Friendly and easy to understand graphical user environment for process technology developer as well as for CAD and design engineers Flexible simulation engine to accommodate new advanced lithographic technology, such as 0.193um wavelength lithography for 90nm and below process