11.5. Bonds
11.5.1. Bonding Logic in Red Hat Enterprise Virtualization
The Red Hat Enterprise Virtualization Manager Administration Portal allows you to create bond devices using a graphical interface. There are several distinct bond creation scenarios, each with its own logic.
Two factors that affect bonding logic are:
- Are either of the devices already carrying logical networks?
- Are the devices carrying compatible logical networks? A single device cannot carry both VLAN tagged and non-VLAN tagged logical networks.
Table 11.3. Bonding Scenarios and Their Results
| Bonding Scenario | Result |
|---|---|
|
NIC + NIC
|
The Create New Bond window is displayed, and you can configure a new bond device.
If the network interfaces carry incompatible logical networks, the bonding operation fails until you detach incompatible logical networks from the devices forming your new bond.
|
|
NIC + Bond
|
The NIC is added to the bond device. Logical networks carried by the NIC and the bond are all added to the resultant bond device if they are compatible.
If the bond devices carry incompatible logical networks, the bonding operation fails until you detach incompatible logical networks from the devices forming your new bond.
|
|
Bond + Bond
|
If the bond devices are not attached to logical networks, or are attached to compatible logical networks, a new bond device is created. It contains all of the network interfaces, and carries all logical networks, of the component bond devices. The Create New Bond window is displayed, allowing you to configure your new bond.
If the bond devices carry incompatible logical networks, the bonding operation fails until you detach incompatible logical networks from the devices forming your new bond.
|